Adhesion Aspects of Thin Films
Volume 1

Edited by K.L. Mittal
December 2001
VSP
ISBN: 90-6764-338-6
288 pages

OUT OF PRINT


This book chronicles the proceedings of the First International Symposium on Adhesion Aspects of Thin Films, held in Newark, New Jersey, October 28-29, 1999. Films and coatings are used for a variety of purposes -- decorative, protective, functional, etc. -- in a host of applications. Irrespective of the intended function or application of a film or a coating, their adequate adhesion to the underlying substrates is of cardinal importance. Concomitantly, the need to understand the factors controlling adhesion and to tailor adhesion to a desired level is quite patent.

This book contains a total of 16 papers, which were presented by researchers from academia, industry and other laboratories, and have been rigorously peer reviewed, suitably revised and properly edited before inclusion. The topics covered include: mechanisms, origin, evolution and measurement of stresses in thin films; surface stress effects on the intrinsic stress; various factors affecting stresses in thin films; delamination of coatings caused by residual stress; effects of surface treatments on the adhesion of metallic films; adhesion of CVD diamond to carbide cutting inserts; effect of carbon contaminant on adhesion of aluminium films; effect of interlayers on adhesion of ceramic coatings; effect of residual stress on adhesion and wear resistance of hard coatings; tribological properties of ceramic films; oxide layers as barrier coatings on a plastic substrate; adhesion aspects of organic coatings to metals; and adhesion of thin plasma polymerised fluorocarbon films.

This book, providing a commentary on the current state of knowledge of adhesion of thin films, will be useful to anyone interested in thin films and will provide ideas on how to improve or tailor adhesion of a film or a coating for a given situation.

Contents:

Preface
Stresses in thin films
J. Bøttiger, J. Chevallier, P. Kringhøj and K.O. Schweitz
Fundamental aspects of residual stress evolution in thin metal films during energetic particle deposition
A. Misra and M. Nastasi
Surface stress effects on the intrinsic stress in thin films
R.C. Cammarata
Influence of the ion bombardment on the stress in thin films produced by ion beam and RF sputtering techniques
S. Scaglione, F. Sarto, A. Rizzo, M. Alvisi and M.A. Tagliente
Delamination of thin hard coatings induced by combined residual stress and topography
U. Wiklund, S. Hogmark and J. Gunnars
Effects of surface treatments on the adhesion of metallic films to ceramic substrates
A.J. Pedraza
The state-of-the-art in adhesion of CVD diamond to carbide cutting inserts
M.A. Taher, W.F. Schmidt, A.P. Malshe, E.J. Oles and A. Inspektor
Adhesion improvement of diamond films to silicon nitride substrate for cutting tools
H. Itoh, R. Sasai, M. Kamiya, S.-S. Lee, K. Kuroda and T. Tsutsumoto
Quantifying the effect of carbon on the practical adhesion of aluminum films to sapphire substrates
J.A. Schneider, S.E. Guthrie, W.M. Clift and N.R. Moody
The effect of a titanium-based interlayer on the adhesion of ceramic coatings
M.T. Vieira, S. Roque and A.S. Ramos
Effect of annealing on residual stress, strength, adhesion and wear resistance of thin, hard coatings on low alloy steel
T.Z. Kattamis and C.G. Fountzoulas
Study of adhesion and tribological properties of some ceramic films
J. Takadoum and B. Cretin
Properties of oxide coatings deposited on a plastic substrate by a successive pulsed plasma anodisation process
B.M. Henry, A.G. Erlat, C.R.M. Grovenor, G.A.D. Briggs and R.P. Howson
Practiacal adhesion of organic coatings to metals: The role of the interphase and its residual stresses
J. Bouchet, A.A. Roche, E. Jacquelin and G.W. Scherer
Epoxy -- diamine adhesives on metal: The interphase formation and characterization
S. Bentadjine, A.A. Roche and J. Bouchet
Improving the adhesion of plasma polymerized thin fluorocarbon films on silicon using (CHF3 + SF6) radio-frequency discharge pretreatments
V. Ianev and N. Schwesinger

Materials Engineering

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